EPP Europe's Report Reveals Key Trends in Electronics
Brussels, Tuesday, 15 July 2025.
EPP Europe’s latest report highlights major advancements in PCB assembly, testing, and packaging technologies, crucial for adapting to new technological demands and market shifts.
Technological Advancements and Market Dynamics
The European electronics market is undergoing a transformation as it adopts new technologies and adapts to rapidly shifting market dynamics. EPP Europe’s recent report underscores significant progress in printed circuit board (PCB) assembly, testing, and packaging technologies, which are essential to the industry’s modernization [1]. These advancements are being driven by demands for greater efficiency and precision, with companies like Axxon-Mycronic spearheading developments in inline inspection tools, such as their Modus CCAOI system, which enhances measurement precision in conformal coating processes [4].
Geopolitical Influences on Semiconductor Investment
A notable trend in the European electronics sector is how geopolitical tensions are influencing semiconductor investments. These tensions, particularly those between China and Taiwan, which houses the world’s leading silicon chip manufacturer, the Taiwan Semiconductor Manufacturing Company (TSMC), are prompting companies to reconsider their production footprints [4]. Europe is witnessing reshoring initiatives whereby companies are bringing semiconductor manufacturing closer to home to mitigate risks associated with geopolitical instability. This movement is changing the investment landscape, emphasizing the importance of domestic production capabilities in securing supply chains [4].
The Role of Advanced Imaging and Testing Techniques
Technological advancements in imaging and testing are also shaping the industry’s future. Innovations like HIKMICRO’s SuperScene algorithm for thermal imaging demonstrate how safety and efficiency can be enhanced in electronic inspections [4]. Such tools are indispensable as the industry stresses the importance of high-quality manufacturing processes, particularly in high-stakes sectors like automotive, aerospace, and defense where precision and reliability are paramount [4].
The Future Roadmap: Connectivity and Sustainability
Looking towards the future, the EU’s policies under the Electronic Communications Code aim to bolster connectivity and promote sustainable growth [2]. The adoption of high-capacity networks and the push for 5G connectivity across Europe as part of the Digital Decade initiative represent major steps towards a more integrated and efficient digital infrastructure. These policies are expected to drive further advancements in the electronics industry by providing a robust framework for innovation and consumer protection [2]. Ensuring access to affordable communication services is anticipated to spur growth and competitive dynamics within the European single market [2].