University of Michigan Secures Funding to Advance Heat-Resistant Semiconductors
Ann Arbor, Sunday, 23 February 2025.
The University of Michigan received initial funding of $2.4 million, with potential for $7.5 million, to develop silicon carbide circuits that withstand extreme temperatures, aiming to enhance aerospace and energy applications.
Groundbreaking Temperature Resistance
The project builds upon NASA Glenn Research Center’s pioneering work in silicon carbide (SiC) semiconductor technology, which has demonstrated remarkable heat tolerance capabilities. These advanced circuits can withstand temperatures up to 930°F (500°C) for thousands of hours [1], vastly outperforming traditional silicon-based electronics that are limited to 257°F (125°C) [2]. In a breakthrough development, NASA Glenn has even demonstrated packaged device operation across an impressive temperature range from -310°F to 1,490°F (-190°C to 812°C) [1].
Strategic Collaboration
The University of Michigan is spearheading this transformative initiative through a collaborative effort with industry leaders. The project, which launched on February 21, 2025, brings together expertise from GE Aerospace Research, Ozark Integrated Circuits, and Wolfspeed [1][2]. This strategic partnership aims to scale up NASA’s SiC technology and manufacturing process to modern wafer dimensions, while simultaneously democratizing SiC chip design [1]. The initiative is funded through the Silicon Crossroads Microelectronics Commons Hub, with an initial investment of $2.4 million and potential funding of up to $7.5 million over three years [2].
Revolutionary Applications
The development of these heat-tolerant semiconductors represents a significant advancement for multiple industries. In aerospace applications, these SiC-based electronics will enable new sensor and actuator functionality, allowing for more flexible modular control systems and simpler engine electrical system architectures [2]. The technology eliminates the need for complex cooling systems currently required for traditional silicon-based electronics, leading to substantial weight reduction and improved efficiency in aircraft engines [1]. The project’s immediate focus includes demonstrating a packaged actuator for aerospace and on-engine applications [1].
Future Impact
Under the leadership of Professor David Wentzloff, the University of Michigan team is developing advanced open-source tools for designing analog and mixed-signal circuits [2]. This work is particularly crucial for managing power, converting real-world data from sensors to digital information, and driving actuators and controllers in jet engines [1]. The project, titled ‘Improving Engine Reliability and SWAP with 350-500 C SiC Electronic Systems,’ represents a significant step forward in the U.S. Department of Defense’s efforts to expand America’s microelectronics capabilities through the CHIPS Act [2].