Renesas Unveils Groundbreaking 3-nm Automotive SoC for Centralized Computing
Munich, Friday, 15 November 2024.
Renesas introduces the R-Car X5H, a revolutionary 3-nm automotive SoC supporting centralized computing with modular chiplets. This advanced chip offers unprecedented performance, including 400 TOPS AI processing and 4 TFLOPS graphics, while reducing power consumption by 30-35% compared to 5-nm predecessors.
Empowering Smart Vehicle Architectures
The introduction of the R-Car X5H at Electronica 2024 marks a significant leap forward in the evolution of centralized automotive computing. By leveraging modular chiplet technology, this system-on-chip (SoC) offers automotive engineers a flexible design experience. This flexibility is crucial as the automotive industry pivots towards software-defined vehicles (SDVs), where the ability to upgrade individual components without overhauling the entire system is invaluable. This shift underscores Renesas’ commitment to enabling smart vehicle architectures that can adapt and evolve with technological advancements.
Technical Excellence and Performance
The R-Car X5H SoC is built using cutting-edge 3-nm process technology, providing automotive manufacturers with the highest level of integration and performance available today. With 32 Arm Cortex-A720AE cores, the chip delivers over 1,000K DMIPS, making it exceptionally capable for advanced driver-assistance systems (ADAS) and autonomous driving applications. Furthermore, the SoC incorporates six Arm Cortex-R52 cores for real-time processing tasks, which are essential for maintaining the safety and reliability standards required in modern vehicles. This configuration supports Automotive Safety Integrity Level D (ASIL D), ensuring the highest safety levels are maintained.
Innovative AI and Graphics Capabilities
One of the standout features of the R-Car X5H is its AI processing capability, achieving up to 400 TOPS through an optimized neural processing unit (NPU) and digital signal processor (DSP). This level of AI processing power is crucial for handling complex tasks in ADAS and other critical systems within the vehicle. In addition, the SoC’s graphics subsystem provides up to 4 TFLOPS, supporting multi-4k media processing and multi-display outputs. This means that not only can the chip handle high-performance computing tasks, but it can also deliver high-quality visual experiences, enhancing in-vehicle infotainment systems.
Scalability and Future-Proofing
The R-Car X5H’s use of chiplet technology offers a scalable solution for automotive manufacturers, allowing them to tailor the chip’s functionalities to suit different vehicle models, from entry-level to high-end. This scalability is facilitated by standardized die-to-die interconnects like the UCIe interface, which ensures interoperability across multi-die systems. By enabling OEMs to enhance AI processing capabilities without redesigning the core SoC, Renesas provides a future-proof solution that can adapt to the ever-changing demands of modern automotive systems. This modular approach not only reduces development time and costs but also aligns with the industry trend towards centralized compute architectures.