Innovations in FETs and Inverter Design Tackle Efficiency and Thermal Challenges

2025-04-30 power

Berlin, Wednesday, 30 April 2025.
Leading industry experts are unveiling new methods in DC-DC converters and inverter designs, emphasizing enhanced efficiency and improved thermal management to meet the increasing demands of the power electronics sector.

Breakthrough in SiC Technology

A significant advancement in power electronics emerged this month with ROHM Semiconductor’s introduction of new SiC molded modules. These innovative modules, available in both 4-in-1 and 6-in-1 configurations, feature voltage ratings of 750V and 1200V, specifically designed for electric vehicle onboard chargers [1]. Complementing this development, SemiQ Inc has unveiled co-packaged 1200V SiC MOSFET modules that achieve remarkable switching speeds as low as 67 nanoseconds, representing a substantial improvement in power conversion efficiency [2].

Compact Power Solutions

Microchip Technology has introduced the MCPF1412, a groundbreaking power module that delivers 12A output in an ultra-compact 5.8 × 4.9 × 1.6 mm package. This innovation reduces board space requirements by over 40% compared to traditional solutions, while maintaining high efficiency through its 16V VIN buck converter design. The module supports both I2C and PMBus interfaces, offering enhanced flexibility for system configuration and monitoring [3].

Thermal Management Innovations

Addressing critical thermal challenges in high-performance computing, xMEMS Labs has extended its µCooling fan-on-a-chip technology to manage thermal bottlenecks in optical interconnects operating at 400G and 800G speeds [4]. This development arrives at a crucial time when enterprise computing systems are transitioning to higher efficiency standards, with modern Power Supply Units (PSUs) required to achieve beyond 91% efficiency in converting and distributing AC power [5].

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power electronics thermal management