Infineon Unveils High-Density Power Modules for AI Data Centers
Munich, Thursday, 10 October 2024.
Infineon Technologies introduces TDM2354xD and TDM2354xT dual-phase power modules, featuring industry-leading current density of 1.6 A/mm². These modules aim to enhance efficiency in high-performance AI data centers, addressing the projected rise in global energy consumption by data centers from 2% to 7% by 2030.
Revolutionizing AI Computational Efficiency
Infineon Technologies’ latest introduction of the TDM2354xD and TDM2354xT dual-phase power modules stands as a groundbreaking move in the realm of AI data centers. With a current density of 1.6 A/mm², these modules are designed to address the burgeoning energy demands associated with the exponential growth of AI technologies. By facilitating vertical power delivery (VPD), the modules not only enhance computational efficiency but also optimize space utilization within data centers. This innovative approach is pivotal as data centers are anticipated to account for nearly 7% of global energy consumption by 2030, up from 2% currently[1].
Technical Advancements in Power Modules
The TDM2354xT modules, capable of accommodating up to 160 A, are the first Trans-Inductor Voltage Regulator (TLVR) modules to be introduced in a compact 8 x 8 mm² form factor[1]. This compact design is crucial for modern data centers where space efficiency is as paramount as performance. Infineon’s use of OptiMOS™ 6 trench technology in these modules further enhances their electrical and thermal efficiencies, making them a reliable choice for high-performance computing environments[2]. The integration of this technology reflects Infineon’s commitment to pushing the boundaries of power management solutions, ensuring that AI data centers can meet future demands without compromising on efficiency or sustainability.
Implications for the Future of Data Centers
Infineon’s latest power modules are set to revolutionize the way data centers operate, particularly in the AI sector. With their focus on optimizing system performance, quality, and total cost of ownership (TCO), these modules promise not only enhanced performance but also significant cost savings over time[1]. As AI applications continue to grow, the need for efficient power solutions becomes increasingly critical. Infineon’s advanced power devices, coupled with their expertise in packaging technologies, provide a comprehensive solution for sustainable computing. By addressing the energy efficiency challenges, these modules are likely to set a new standard in the industry, paving the way for next-generation AI data centers that are both powerful and environmentally responsible.