M31 Unveils USB4 IP for TSMC's 5nm Process, Boosting Data Transfer Speeds

M31 Unveils USB4 IP for TSMC's 5nm Process, Boosting Data Transfer Speeds

2024-11-07 industry

Hsinchu, Thursday, 7 November 2024.
M31 Technology has successfully validated USB4 IP on TSMC’s 5nm process, enabling 40 Gbps data transfer rates. This breakthrough supports multi-protocol tunneling and is compatible with previous USB standards, catering to next-generation mobile and high-performance computing needs.

Collaboration and Innovation

The successful validation of M31’s USB4 IP on TSMC’s 5nm process is a significant milestone in semiconductor technology. This achievement marks the result of a deep collaboration between M31 Technology and TSMC, reflecting a strategic partnership that has been instrumental in overcoming design challenges associated with low-voltage and high-speed data transfer. Jerome Hung, Vice President of R&D at M31, emphasized the importance of this partnership in ensuring that the USB4 IP meets the highest standards of performance and reliability[1].

Technical Specifications and Capabilities

M31’s USB4 IP is a leap forward in the evolution of USB architecture, supporting up to 40 Gbps data transfer rates. It allows for multi-protocol tunneling, enabling simultaneous data transmission over USB, DisplayPort, and PCIe connections. This makes it suitable for a wide range of applications, from mobile devices to high-performance computing environments. Furthermore, the IP is backward compatible with USB 3.2, USB 2.0, and Thunderbolt 3, ensuring a seamless integration with a diverse array of existing and future devices[2].

Impact on the Semiconductor Industry

The launch of the USB4 IP on the advanced 5nm process is poised to significantly impact the semiconductor industry by enhancing the performance and efficiency of next-generation devices. Operating at an optimized 1.2 V IO voltage, the IP addresses critical aspects of power consumption, performance, and area (PPA), making it ideal for portable electronics and high-performance computing applications. This innovation is set to meet the growing demand for faster and more reliable data transfer solutions[3].

Future Prospects and Market Implications

As M31 Technology continues to innovate in the field of silicon IP, its ongoing collaboration with TSMC positions it at the forefront of technological advancement. The USB4 IP’s introduction not only strengthens M31’s market leadership in high-speed data transfer solutions but also underscores Taiwan’s competitive position in the global IP market. Moving forward, M31 aims to expand its portfolio of high-performance IP solutions to cater to the evolving needs of global markets, particularly in AI, 5G, and automotive electronics[4].

Bronnen


Semiconductor www.prnewswire.com USB4 tw.news.yahoo.com money.udn.com www.m31tech.com