GaN and SiC Boost Power Conversion Efficiency
Brussels, Friday, 28 March 2025.
Wide Bandgap Semiconductor materials, such as GaN and SiC, are revolutionizing power electronics by enhancing efficiency and reliability, particularly in the European market.
Market Growth and Industry Transformation
The wide bandgap semiconductor market is experiencing unprecedented growth, with the global SiC and GaN power devices sector projected to expand from USD 2.48 billion in 2024 to USD 31.18 billion by 2033, representing a compound annual growth rate of 32.5% [1]. This remarkable expansion is driven by increasing demands in renewable energy systems and advancements in consumer electronics [1]. Recent developments at APEC 2025 have showcased the industry’s evolution, with 64% of industry experts favoring GaN technology for future applications [2].
Efficiency Breakthroughs
Significant technological breakthroughs are reshaping the power electronics landscape. Navitas Semiconductor has recently exceeded the new 80 PLUS ‘Ruby’ certification standards, achieving peak efficiencies of 99.3% in their latest power supply units [3]. These improvements are particularly crucial for data centers, where every percentage point improvement in efficiency can reduce energy consumption by 10 TWh, equivalent to approximately 3.5 million tons of CO2 [3]. In motor drive applications, GaN-based inverters have demonstrated exceptional performance, achieving 98.74% efficiency with just 34.58W power loss at 55 kHz [4].
Innovation and Market Competition
The competitive landscape is evolving rapidly, with major manufacturers introducing innovative solutions. Cambridge GaN Devices (CGD) has recently announced breakthrough technology for the EV inverter market, potentially addressing a sector worth over $10 billion [5]. Their ICeGaN® technology combines smart ICeGaN HEMT ICs with IGBTs in a single module, offering a cost-effective alternative to traditional solutions [5]. However, the industry faces some challenges, with major players implementing strategic restructuring - including over 8,800 reported layoffs across leading semiconductor companies [2].
Future Outlook
The industry is poised for continued innovation and growth, with several key developments on the horizon. Nexperia’s recent launch of 1200V SiC MOSFETs with advanced X.PAK packaging demonstrates ongoing technological advancement [2]. The upcoming PCIM Expo & Conference 2025, scheduled for May 6-8 in Nuremberg, will feature over 600 exhibitors and 450 presentations [6], highlighting the industry’s robust innovation pipeline. With major research initiatives underway at institutions like Silicon Austria Labs and TU Graz [2], the sector is well-positioned for continued advancement in power conversion efficiency.
sources
- www.businessresearchinsights.com
- www.linkedin.com
- www.globenewswire.com
- ieeexplore.ieee.org
- www.businesswire.com
- www.linkedin.com