Sivers and O-Net Partner to Revolutionize European Optical Networking
Stockholm, Tuesday, 1 April 2025.
Sivers Semiconductors and O-Net Technologies announced a strategic collaboration on March 28, 2025. This partnership aims to deliver high-performance external laser sources, advancing AI factories and data centers.
Strategic Integration of Advanced Technologies
Under the newly formed partnership, O-Net Technologies will integrate Sivers’ advanced Distributed Feedback (DFB) laser arrays into their External Laser Small Form Factor (ELSFP) optical modules [1]. This technical collaboration specifically targets the growing demand for Co-Packaged Optics (CPO) in switches, network interface cards, and artificial intelligence applications, promising significant reductions in power consumption compared to traditional pluggable transceiver technology [2].
Market Impact and Industry Leadership
The timing of this partnership is particularly strategic, as global fab equipment spending is projected to increase by 2.2 billion in 2025, with a further 18% rise to $130 billion anticipated in 2026 [3]. Vickram Vathulya, CEO of Sivers Semiconductors, emphasized that this collaboration represents a significant milestone for optical communication technologies, enabling broader market access for next-generation DFB lasers [1].
European Semiconductor Landscape
This partnership aligns with broader European semiconductor initiatives, where sustainability and technological advancement are key priorities [4]. The European electronics sector has been actively working to strengthen its semiconductor supply chain, with this collaboration representing a significant step forward in optical networking capabilities [5]. The partnership was strategically announced on March 28, 2025, positioning it within the broader context of European efforts to enhance semiconductor manufacturing capabilities [3].
Future Implications and Development
O-Net Technologies’ Chairman Austin Na has highlighted how this collaboration addresses the growing demand for high-capacity, energy-efficient networking solutions in AI datacenter deployments [2]. The partnership comes at a crucial time when the semiconductor industry is experiencing increased focus on AI integration and facing various supply chain challenges [4]. This development is expected to contribute to the advancement of European semiconductor capabilities, particularly in the specialized field of optical networking solutions [5].