Wolfspeed Launches Gen 4 Silicon Carbide Technology to Boost Efficiency

Wolfspeed Launches Gen 4 Silicon Carbide Technology to Boost Efficiency

2025-01-23 power

Munich, Thursday, 23 January 2025.
Wolfspeed introduces its Gen 4 Silicon Carbide platform, set to enhance efficiency and reduce costs in high-power electronics, supporting sectors like automotive and renewable energy.

Revolutionary Advancement in Power Electronics

On January 22, 2025, Wolfspeed unveiled its groundbreaking Gen 4 silicon carbide MOSFET technology platform, marking a significant milestone in power electronics innovation [1][2][3]. The new platform delivers impressive performance improvements, including up to a 21% reduction in on-resistance at operating temperatures and 15% lower switching losses [2]. As the only U.S.-based producer with both silicon carbide material and device fabrication facilities, Wolfspeed’s launch strengthens domestic semiconductor production capabilities [2].

Technical Specifications and Performance Gains

The Gen 4 platform encompasses voltage ranges of 750V, 1200V, and 2300V, specifically engineered for high-power applications [1][2]. The technology demonstrates superior durability with a short-circuit withstand time of up to 2.3 microseconds [3]. A notable advancement is the 75% reduction in voltage overshoot during turn-on events, significantly improving electromagnetic interference (EMI) performance [3]. The platform’s enhanced cosmic ray reliability achieves a 100× reduction in failure-in-time rates, while supporting continuous operation at 185°C and intermittent operation at 200°C [3].

Industry Impact and Applications

The technology is poised to transform several key sectors, including electric vehicle powertrains, renewable energy systems, and AI data centers [1][2]. Jay Cameron, Senior Vice President of Wolfspeed power products, emphasizes that ‘From its inception, our goal for Gen 4 has been to improve overall system efficiency in real-world operating environments’ [5]. The platform’s enhanced efficiency and reduced system costs are particularly significant for EV applications, where improved power density and thermal management are crucial [3].

Future Roadmap and Availability

Executive Chairman Tom Werner announces that ‘Our Gen 4 platform will be delivered via our highly efficient 200mm wafers, which will enable us to deliver products on a scale and level of yield not seen in this industry before’ [2]. Wolfspeed has planned additional product introductions throughout 2025 and early 2026 [5], establishing a comprehensive roadmap for future developments. The technology’s drop-in compatibility simplifies the transition for existing users, reducing redesign efforts while providing immediate performance benefits [1].

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Silicon carbide Power efficiency