Innovations in EV Component Design Enhance Safety and Efficiency
Munich, Wednesday, 23 April 2025.
Recent advances in automotive electronic design focus on PCB and IC package simulations to improve EV safety and efficiency, addressing heat and interference challenges in European markets.
Advanced Simulation Technologies Drive Innovation
The automotive electronics industry is witnessing a fundamental shift toward sophisticated simulation-based design approaches. With zero tolerance for field failures due to safety implications, manufacturers are increasingly relying on comprehensive PCB and IC package simulations [1]. These advancements are particularly crucial for electric vehicle components, where thermal management and electromagnetic interference present significant challenges [2]. The integration of artificial intelligence in electronic design automation (EDA) has emerged as a critical factor, with companies like Altair leading the transformation through advanced multi-physics simulation tools [5].
Enhanced PCB Design Specifications
Modern automotive PCBs demonstrate marked improvements in durability and performance specifications. These specialized components feature thickness ranges from 0.6mm to 3.2mm, notably more robust than standard PCBs [3]. The automotive PCB market is experiencing substantial growth, with projections indicating the global market will exceed USD 14 billion by 2024 [3]. A significant development in this sector is the introduction of high-performance MOSFETs, such as Infineon’s OptiMOS™ 5 technology, which operates at temperatures up to 175°C and is specifically designed for HV-LV DCDC converters in electric vehicles [4].
Industry Collaboration and Future Outlook
European manufacturers are positioning themselves at the forefront of this technological evolution through strategic partnerships and innovation initiatives. Würth Elektronik, a leading European PCB manufacturer with over 50 years of experience, is scheduled to host a comprehensive design and simulation workshop on April 30, 2025, focusing on sustainable PCB designs and new technology applications [6]. This collaborative approach to knowledge sharing is essential as the industry faces increasing complexity in designs and a widening talent gap [5].
sources
- community.cadence.com
- www.cadence.com
- www.pcbasic.com
- www.infineon.com
- www.digitimes.com
- passive-components.eu